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SoC Chip Lead

SoC Chip Lead

NXP Semiconductorsbhubaneswar, orissa, in
12 hours ago
Job description

MPU Engineering team defines and develops System on Chip, ASIC’s, Digital and Analog IP’s for a wide range of products, including automotive microprocessors, application processors, microcontrollers, and network processor.

Responsibilities : -

  • Lead product execution for Automotive / Consumer / Industrial ASIL-B / D SoC’s
  • Work with architects and systems engineering to define the part. Generate and analyze data to

take right and cost-effective architecture decision.

  • Work with IP, Technology, packaging partners to assess the right IP / packages and technology

    • options for the part.

  • Work with IP and SoC functions (front end, verification, AMS, DFT, Physical implementation) to

    • understand and resolve inter / intra functional handoff and challenges.

  • Oversee definition management and make sure the implementation complies with the

    • requirements

  • Work closely with downstream team's dependent on SOC, who are working on post-silicon

    • activities, to make sure their needs are addressed

  • Work closely with Test and Product engineering teams to enable productization.
  • Work closely with post silicon evaluation teams (functional and analog Validation,

    • Characterization, Application and Software teams) and address design issues.

  • Work with Program management office for management attention and clearly articulate

    • dependencies and help needed for timely execution of projects.

  • Assess workload and resource demands based on complexity and create predictable project

    • plans meeting customer requirements

  • Mentor engineers across various functions Cross functional aspects :
  • This role is primarily about leading cross functional teams
  • During part definition is includes a close interaction with Business, Systems, Architects, third party

    • IP vendors

  • During execution a close interaction and decision making is required between Technology,

    • packaging, IP, Architecture, Various implementation functions, Test and Product Engineering.

  • Post silicon, close collaboration is needed with Software, Test and production engineering,

    • Application and Field teams.

  • Overall, Chip lead is central design point of contact for all cross functional teams associated with

    • the part.

    Job Qualifications :

  • Bachelor‘s in engineering with 15 years of design development experience, with at least 5 years

    • of leading complete design and / or design functions.

  • B.Tech / M.Tech
  • Experience in leading Global cross functional teams
  • Experience in leading designs in smaller geometries desired
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    Soc Lead • bhubaneswar, orissa, in

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