Must have / Eligibility criteria
- BE / ME in Electrical or Electronics or related technical field. Master's degree preferred
- At least 4–5.5 years of relevant experience in semiconductor product development
- First-hand knowledge in System Design and / or Packaging Experience
- First-hand knowledge of semiconductor manufacturing processes (design, process, fabrication, assembly, testing)
- Candidate should demonstrate interpersonal communication (including verbal and written communication), creative problem-solving, time management, and team building skills
- We look for a person who is curious enough to take a deep dive into a new and latest technology to explore anything anytime
Good to have / Key differentiators (expertise in any of the following fields)
Expertise in Semiconductor packagingExpertise in semiconductor process and fabricationExpertise in designing any high-speed IO and SERDES architectureExperience in analog circuits including power management circuits such as converters, regulators; clock generators such as Crystal Oscillator, RC Oscillator, PLL, clock buffers and dividers, etc.Have good knowledge on the JEDEC memory specifications for semiconductor memory circuits and similar storage devicesPCB or card or module layout experience, with layout tools such as Cadence, Mentor Graphics, OrCADPrevious work experience with CMOS image sensorsSkills Required
semiconductor packaging