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Technical Lead – Mechanical

Technical Lead – Mechanical

CoreEL TechnologiesBengaluru, Karnataka, India
4 hours ago
Job description

Professional Skills :

  • Minimum 10 years’ experience in designing Air cooled and conduction cooled electromechanical Enclosures and Chassis for defense / Avionics / Telecom industry.
  • Experience in milled, sheet metal and plastic enclosure designs.
  • Knowledge in 19-inch rack, ATR, VPX, JSS55555, DO-160, VME and ATCA standards.
  • 10-years’ experience in Solid works / any design and drafting tools
  • Knowledge of Structural and Thermal analysis.
  • Ability to manage 2-member team
  • As a Mechanical Engineer- Electronics Packaging specialist, you will be responsible for developing portions of the lithography system and / or associated tooling related to the electronics infrastructure.
  • The position requires highly motivated, extremely organized and self-driven individuals. As a Mechanical Engineer- Electronics Packaging Specialist will :
  • Perform mechanical design and development associated with packaging electronic circuits including, assembly design, analysis, test, and manufacturing introduction support for both new and existing electronics design projects.
  • Understand and mitigate possible failure mechanisms associated with materials, interconnects, and environmental loads to develop a reliable design.
  • Communicate with a team of multi-disciplined engineers (Systems , Electrical, Mechanical, Manufacturing, New Product Logistics, and Product Information Management) for design and logistic release approval.
  • Investigate and edit product structures, generate CAD models, 2D / 3D drawings and be responsible for the final technical data package.
  • Create, edit, review, and drive Engineering Changes to closure.

Self-Checking and Peer-Checking department designs and change notifications

Roles and Responsibility :

  • Ability to take up mechanical design independently.
  • Interact with customers and project team, capture input and design accordingly.
  • Design the components to meet DFM and DFA and customer requirement.
  • Should be a team player.
  • Ability to manage 2-member team.
  • Mandatory Skill Set :

  • Minimum10 years’ experience in designing Air cooled and conduction cooled electromechanical Enclosures and Chassis for defense / Telecom industry.
  • Proficiency in Solid works and AutoCAD.
  • Good knowledge about BOM creation, material selection, Fastener selection, CNC machining and surface finish process.
  • Vendor development activities.
  • Desired Skill Set :

  • Knowledge in Structural and Thermal analysis.
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    Technical Lead • Bengaluru, Karnataka, India

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