RF Engineering Team Lead

About Mistral :

High-Density Interconnect PCBs have a higher wiring density per unit area than conventional PCB and are utilized in complex small form factor designs. This advancement in PCB design is being driven by the miniaturization of components and semiconductor packages that supports advanced features that are getting utilized in revolutionary new products like wearable electronics, touch screen computing, compact, small footprint gadgets, defense, and aerospace applications.

Mistral’s expert team has extensive experience in offering High-Density Interconnect PCB designs including microvias, blind and buried vias, fine lines, and spaces, sequential lamination, via-in-pad technology-based techniques.

Why Mistral?

1. Core Technology Company

2. Flexibility to Work Across Domains

3. Great Learning Opportunity on newer Technologies

4. Flexibility to learn…Freedom to execute…Opportunity to grow

5. Can Gain Expertise – Complete Product Cycle

6. Process Oriented

7. Open Culture, Easy Accessibility to Seniors & Management

Job Description : Scope of work :

• Design and circuit simulation of RF systems
• Aware of RF and Analog Circuit Design Constraints – Knowledge of Transceiver designs preferable
• Mixed Signal Design
• Frequency synthesizer Designs
• EM Simulation and optimisation of Layout using various software
• Simulation of RF related section of PCB Layout
• Hardware Design flow from specification to testing preferred
• Test plan, guidance and review of test results of RF circuits and components

Technical skills :

Soft skills :

Additional Info :

Experience Range : 2 to 8 years

Work Location : Bangalore