Role Summary
Optimized Solutions Limited (OSL) architects and delivers board- and system-level electronic hardware for defence and space customers on a project and engineering-services basis. We are seeking a Hardware Solutions Architect to own the technical delivery of customer hardware projects end to end capturing requirements, architecting the bespoke solution, and driving it through design, integration, qualification, and customer acceptance while leading a cross-disciplinary engineering team across concurrent projects. The role also anchors engineering-services engagements (design, integration, bring-up, and sustaining support) and provides the technical depth behind bids and proposals.
Key Responsibilities
• Own end-to-end technical delivery of customer hardware projects: requirement capture → solution architecture → detailed design → integration → qualification → acceptance (FAT / SAT).
• Translate customer and RFP/RFQ requirements into a compliant, cost-optimized hardware architecture for each project, with clear compliance and trade-off rationale.
• Architect FPGA and SoC baseboards, high-speed digital, DDR, high-speed data-acquisition (ADC/DAC), RF/analog front-ends, and clock distribution/synthesis per project need.
• Partition each solution across FPGA, firmware/microcontroller, RF, and embedded Linux (PREEMPT_RT / BSP) domains and define the inter-domain interfaces.
• Drive Signal Integrity (SI), Power Integrity (PI), power-supply and thermal design, signal conditioning, isolation/conversion (analog & digital isolators, V/I, V/F, optical links), and form-factor choices (6U / 4U rugged, hot-swappable / hot-pluggable, backplane).
• Lead and coordinate a cross-disciplinary team RF, FPGA/VHDL, firmware, embedded Linux, PCB layout, and schematic across multiple concurrent deliveries.
• Own project technical planning and gates: schedule, design reviews (PDR / CDR), risk, and first-time-right integration, in coordination with project / programme management.
• Plan and execute environmental and EMI/EMC qualification and customer-acceptance campaigns ESD, EFT/burst, surge, radiated & conducted emission (RE/CE), radiated & conducted susceptibility (RS/CS) on power and COM ports, power-frequency magnetic field, common-mode immunity, vibration, and dry-heat/temperature.
• Support bids and proposals (feasibility, architecture options, effort and BOM estimates, compliance matrices) and anchor engineering-services engagements design services, board/system integration, hardware bring-up, and sustaining engineering for delivered systems.
• Act as the customer-facing technical authority through the project lifecycle reviews, clarifications, acceptance, and post-delivery support.
Technical Domains & Competencies
Digital / FPGA & SoC
FPGA baseboard & SoC baseboard architecture, Xilinx FPGA / SoC, VHDL, Verilog, high-speed digital, DDR, high-speed ADC/DAC data acquisition.
RF, Analog & Clocking
RF & analog front-end architecture, RF/analog signal-chain design & board bring-up, clock distribution, synthesizers, clock alignment, low-jitter reference, breakout ports.
SI / PI / Power
Signal integrity, power integrity, power-supply design, power sequencing, signal conditioning, thermal design.
Isolation & Conversion
Analog & digital isolators, voltage-to-current (V/I), voltage-to-frequency (V/F), optical / electro-optical links.
Integration & Form Factors
Microcontroller interfacing, board-to-board & backplane integration, 6U / 4U rugged cards, hot-swappable / hot-pluggable boards, card-cage / chassis integration.
Embedded SW (system level)
Embedded C, Linux BSP, PREEMPT_RT / RT-Linux systems-level understanding for HW/SW integration.
Qualification & Acceptance
EMI/EMC & environmental test planning, ESD, EFT, surge, RE/CE, RS/CS, PFMF, common-mode, vibration, dry heat, FAT / SAT customer acceptance.
Candidate Profile
• B.E./B.Tech or M.Tech in Electronics / ECE / EEE / E & I / I & C, or equivalent.
• 8-12 years in electronic hardware design/architecture, of which 8 years delivering customer projects in an architect or technical-lead capacity.
• Proven track record delivering board- and system-level hardware projects to qualification and customer acceptance defence / aerospace / space electronics preferred.
• Comfortable running multiple concurrent projects and leading layout, RF, FPGA, firmware, and Linux engineers, hands-on schematic + architecture background.
• Strong applied mathematics and DSP fundamentals, direct customer-facing requirement-capture, review, and acceptance experience, exposure to bid/proposal technical support.
Preferred / Advantageous
• Exposure to defence/space qualification and acceptance standards e.g. MIL-STD-461 (EMI/EMC) and MIL-STD-810 / JSS 55555 (environmental) class testing.
• RF systems, RF transceivers, and high-speed DAQ platform experience, familiarity with defence/space procurement and delivery processes.
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Skills Required
power integrity , Emc, Dac, Soc, Bsp, Verilog, Embedded C, Emi, data acquisition, Signal Integrity, Thermal Design, Fpga, Linux, Ddr, Vhdl