Lithography Process Engineer Semiconductor Wafer Fabrication

Lithography Process Engineer Semiconductor Wafer Fabrication

Location: Ahmedabad, Gujarat, India

Work Mode: Onsite

Experience: 6 -15 Years

Role Overview

We are seeking an experienced Lithography Process Engineer to support the development, optimization, qualification, and production of advanced photolithography processes within a semiconductor wafer fabrication facility. This role is responsible for establishing robust lithography processes that enable high-yield, high-volume manufacturing while meeting critical dimension (CD), overlay, defectivity, and process capability requirements.

The successful candidate will work closely with Process Integration, Equipment Engineering, Yield Engineering, Metrology, Manufacturing, and Quality teams to optimize photolithography performance, improve process stability, support technology transfers, and drive continuous yield improvement initiatives. Experience with advanced lithography equipment, photoresists, process characterization, and Statistical Process Control (SPC) is highly desirable.

Key Responsibilities

• Develop, optimize, and sustain semiconductor photolithography processes for advanced wafer manufacturing.
• Define and establish lithography process windows to achieve robust manufacturing performance.
• Optimize photoresist coating, soft bake, exposure, post-exposure bake, development, and hard bake processes.
• Improve critical dimension (CD) uniformity, overlay accuracy, and process capability across production lots.
• Support technology transfer activities from development to high-volume manufacturing (HVM).
• Perform Design of Experiments (DOE) to optimize lithography parameters and process robustness.
• Analyze inline metrology data, CD measurements, overlay results, defect inspection reports, and electrical test data.
• Drive process yield improvement through defect reduction and root cause analysis.
• Work closely with Process Integration Engineers to optimize interactions between lithography and downstream process modules.
• Collaborate with Equipment Engineering to improve tool availability, process repeatability, and equipment performance.
• Evaluate and qualify new photoresists, anti-reflective coatings (BARC), developers, and lithography materials.
• Support qualification and commissioning of new lithography equipment.
• Develop process documentation, operating procedures, and engineering specifications.
• Utilize Statistical Process Control (SPC) techniques to monitor process health and identify process excursions.
• Support Advanced Process Control (APC) implementation to improve process consistency.
• Participate in new product introduction (NPI) and technology ramp activities.
• Review yield trends and implement corrective and preventive actions.
• Ensure compliance with semiconductor manufacturing quality systems and safety procedures.
• Support continuous improvement initiatives focused on cycle time, productivity, defect reduction, and cost optimization.

Key Responsibilities During Fab Startup

• Participate in lithography tool installation and qualification.
• Develop baseline lithography process recipes.
• Establish CD and overlay control methodologies.
• Support equipment acceptance testing (SAT/FAT).
• Optimize process capability during technology ramp.
• Define process qualification criteria.
• Build process documentation for manufacturing operations.
• Train manufacturing personnel on lithography processes.
• Support pilot production and engineering lots.
• Drive stable production readiness before high-volume manufacturing.

Required Qualifications

• Bachelor's or Master's degree in Electronics Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, Semiconductor Engineering, or related discipline.
• 6 -15 years of experience in semiconductor wafer fabrication.
• Strong hands-on experience with semiconductor photolithography processes.
• Experience working in 200mm and/or 300mm wafer fabrication facilities.
• Proven experience supporting technology transfer and production ramp.
• Strong analytical and troubleshooting skills.
• Excellent communication and cross-functional collaboration abilities.

Technical Skills Semiconductor Manufacturing

• Semiconductor Wafer Fabrication
• Front-End Manufacturing (FEOL)
• CMOS Process Technology
• High Volume Manufacturing (HVM)
• Process Development
• Process Optimization
• Technology Transfer
• New Product Introduction (NPI)

Lithography Processes

• Photolithography
• Photoresist Processing
• Spin Coating
• Soft Bake
• Exposure
• Focus Optimization
• Dose Optimization
• Post Exposure Bake (PEB)
• Development Process
• Hard Bake
• Pattern Transfer
• Alignment Optimization
• Overlay Control
• Critical Dimension (CD) Control
• Defect Reduction

Lithography Equipment

Experience with equipment from leading semiconductor manufacturers is highly desirable, including:

• ASML DUV Steppers
• ASML Immersion Lithography Systems
• Canon Steppers
• Nikon Lithography Systems
• Coat/Develop Track Systems
• Resist Processing Equipment
• Bake Systems
• Developer Systems

Lithography Materials

• Positive Photoresists
• Negative Photoresists
• Bottom Anti-Reflective Coating (BARC)
• Top Anti-Reflective Coating (TARC)
• Developers
• Solvents
• Adhesion Promoters
• Cleaning Chemicals

Metrology

• CD-SEM
• Overlay Metrology
• Optical Inspection
• Film Thickness Measurement
• Defect Inspection
• Particle Inspection
• Surface Profiling
• Scatterometry

Process Engineering

• Design of Experiments (DOE)
• Statistical Process Control (SPC)
• Process Capability (Cp/Cpk)
• Root Cause Analysis
• Process Qualification
• Process Window Characterization
• FMEA
• Continuous Improvement
• Process Validation

Data Analysis

• JMP
• Python
• MATLAB
• Excel
• SQL
• Statistical Analysis
• Data Visualization

Cross Functional Collaboration

The Lithography Process Engineer Will Work Closely With

• Process Integration
• Equipment Engineering
• Yield Engineering
• Device Engineering
• Manufacturing Operations
• Metrology
• Facilities Engineering
• Automation Engineering
• Quality Engineering
• Process Control Engineering
• Failure Analysis
• Product Engineering

Preferred Industry Experience

Candidates with experience from semiconductor wafer fabrication facilities such as:

• Logic
• Foundry
• Memory
• Power Semiconductor
• Analog/Mixed Signal
• RF Semiconductor
• CMOS Manufacturing

Experience in greenfield fab startups or advanced technology nodes is highly desirable.

#LI-SD1

Skills Required
spin coating , Sql, Excel, Data Analysis, Jmp, photolithography, Matlab, Python