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Advanced Analog / Mixed-Signal Layout Engineer

Advanced Analog / Mixed-Signal Layout Engineer

Best NanoTechRepublic Of India, IN
1 day ago
Job description

Experience : 8+ Years

Location : Remote / India (must support USA / Canada time zone)

Travel : Willing to travel to the U.S. for project release (as required)

Role Overview :

We are looking for a Senior Analog Layout Engineer to work on a high-speed analog chip development in advanced TSMC 5nm technology. The candidate will operate as an individual contributor, responsible for delivering complex high-speed analog and mixed-signal layout blocks with minimal supervision.

This role demands deep technical expertise in chip-level integration, bump planning, and ESD implementation, along with a good understanding of circuit simulation concepts. The engineer will work closely with SoC, Circuit, and Digital teams to ensure robust layout quality and performance.

Key Responsibilities :

  • Own end-to-end schematic-to-layout design for high-speed analog and mixed-signal circuits.
  • Perform floor planning, bump and pad-ring design, and ESD implementation at the chip level.
  • Collaborate with SoC, circuit, and digital design teams for layout integration and signoff.
  • Ensure layouts meet all DRC, LVS, ERC, EM / IR and reliability standards.
  • Handle layout matching, shielding, and parasitic optimization for high-speed performance.
  • Support simulation correlation and assist in debugging layout-related circuit issues.
  • Work independently, taking full ownership of assigned IPs and layout deliverables.

Required Skills and Expertise :

  • 8+ years of hands-on experience in Analog & Mixed-Signal Layout, focusing on high-speed analog chips (High-Speed Converters).
  • Proven expertise with TSMC 5nm FinFET technology and advanced layout techniques.
  • Strong understanding of chip-level planning, bump mapping, and ESD design.
  • Familiarity with simulation and circuit performance basics (gain, bandwidth, noise, etc.).
  • Proficiency in Cadence Virtuoso, Calibre, and PVS.
  • Excellent grasp of symmetry, matching, shielding, and low parasitic layout design.
  • Ability to work independently and coordinate effectively with global teams.
  • Flexibility to work in USA / Canada time zones and travel abroad if required.
  • Preferred :

  • Experience with PCIe & GDDR.
  • Exposure to Chip-Package Co-Design (CPCD) and advanced ESD methodologies.
  • Prior experience in product-level high-speed analog chip delivery.
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    Engineer • Republic Of India, IN

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