MTS - Design Integration

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Design Technical Lead Integration Engineer in the Non-Volatile-Engineering NAND Flash design team at Micron Technology, Inc., you will be taking a leading role in full chip-level integration activities. Your responsibility will include a floorplan, signal / power planning, full-chip schematic building, and chip-level quality checks. You will work with and support the efforts of functional teams to innovate and evaluate key multi-functional features and architecture to assure outstanding memory products in terms of die size, performance, reliability, and power. In this position, you will also work with and support the efforts of groups such as Product Engineering, Test, Probe, Quality and Reliability, Process Integration, Assembly and Marketing to proactively design products to optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will actively participate in the design and quality methodology improvements across the department. You will also be responsible for assisting product engineers in post-silicon design validation, root cause analysis, and providing solutions.