Tech Innovation Lead

Job Title : Tech Innovation Lead

Location : Udyog Vihar, Gurgaon

Professional Experience : Minimum 15 years

Department : Tech Innovation Group (TIG)

Timeline for Hiring : Immediate

Application Deadline : 17 Sep 2025

CTC : INR 2,00,000 / - to INR 3,00,000 / - per month

About the Company :

ZOOM Communications is South Asia's leading provider of Live Broadcast Services, serving a prestigious client base across Sports, Media, Entertainment, and News. A pioneer in the Indian broadcast industry for over two decades, ZOOM has delivered high-profile national and international projects including the ICC U-19 World Cup, FIFA U-17 World Cup, Asian Games, Commonwealth Games, IPL, WPL, ISL, National Games, G-20, P-20, Bigg Boss, Indian Idol, and many more. The company also specializes in building cutting-edge studios for India's top news channels and executing large-scale, turnkey Systems Integration projects.

Expanding beyond broadcasting, ZOOM is rapidly growing its footprint in strategic technology sectors and next-generation engineering—delivering innovative solutions and forging key partnerships that drive technological and global progress. Be part of our mission-driven growth and help shape the future of technology.

Job Summary

We are seeking a highly motivated and experienced Tech Innovation Lead to drive next-generation product development and lead a multidisciplinary engineering team comprising Electronics, Mechanical, and Embedded Systems specialists. The ideal candidate is a strategic thinker and hands-on problem solver with a strong background in product innovation, systems engineering, and cross-functional team leadership.

This role requires a deep understanding of electronic hardware, embedded firmware, and mechanical design principles, along with a proven ability to coordinate complex R&D efforts from concept through to production. The Tech Innovation Lead will be responsible for aligning technical execution with business goals, fostering collaboration across teams, and ensuring the delivery of high-performance, manufacturable, and innovative solutions.

Key Responsibilities

• Lead Cross-Functional Engineering Teams : Manage and coordinate the efforts of Electronics, Mechanical, and Embedded Systems teams to ensure alignment with project goals and technical excellence.
• Drive End-to-End Product Development : Oversee the design, development, and integration of complex, high-reliability systems from concept to production, ensuring performance, durability, and manufacturability.
• Strategic Technical Leadership : Define system architecture, guide technical decision-making, and ensure synergy across hardware, firmware, and mechanical domains.
• Innovation & Prototyping : Foster a culture of innovation by guiding rapid prototyping efforts, encouraging new ideas, and exploring emerging technologies for next-generation products.
• System Integration : Ensure seamless integration across electrical, mechanical, and embedded components, with a focus on IP-rated (IP65 / IP68) ruggedized systems for harsh environments.
• Technical Oversight : Review and approve designs, schematics, PCB layouts, enclosure models, and firmware structures to maintain technical quality and compliance with industry standards.
• Testing & Validation : Oversee testing, validation, and debugging across all subsystems using industry-standard lab tools and methodologies.
• Project & Resource Management : Plan and manage resources, timelines, and deliverables across multiple concurrent R&D projects.
• Documentation & Compliance : Ensure high-quality documentation across all disciplines for manufacturing, compliance, assembly, and certification processes.
• Mentorship & Collaboration : Mentor engineers across disciplines, facilitate technical reviews, and drive collaboration to solve complex challenges in a fast-paced innovation environment.

Required Skills & Qualifications

Technical Expertise :

Leadership & Communication :

Soft Skills

Educational & Other Qualifications

Why Join Us

How to Apply :

Interested candidates may send their CV along with cover letter to [HIDDEN TEXT] with the subject line :

'Application for Tech Innovation Lead' latest by 17 September 2025.

Note : Only selected candidates will be contacted.

Skills Required

Thermal Design, Electronic Circuit Design, Pcb Design, schematic capture, bom management