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▷ Apply in 3 Minutes : Lead Reliability and Qualification Engineer

▷ Apply in 3 Minutes : Lead Reliability and Qualification Engineer

L&T Semiconductor TechnologiesBengaluru, Karnataka, India
2 days ago
Job description

Role : Lead - Reliability and Qualification Engineer

Experience : 12+ years of experience in Reliability and Qualification Engineering within the Semiconductor IC development field

Job Description :

Lead Reliability and Qualification Engineer will be responsible for driving the entire qualification process, ensuring that products meet both internal and customer-specific requirements. You will work closely with cross-functional teams, including design, process, and manufacturing teams, to develop and execute comprehensive qualification plans that align with product category requirements.

Key Responsibilities :

  • Develop detailed qualification plans based on the product category (Automotive / Industrial / Energy) and customer requirements
  • Develop and execute reliability tests for semiconductor ICs, ensuring that products meet reliability and qualification requirements, including stress testing, accelerated life testing, environmental testing and regulatory standards
  • Collaborate with design teams to review and validate semiconductor IC designs for reliability, ensuring design for reliability (DFR) best practices are followed
  • Lead and manage the execution of qualification tests for Semiconductor ICs, ensuring reliability and durability under extreme conditions
  • Oversee testing phases, including but not limited to High Temperature Operating Life (HTOL), Electrical Overstress (EOS), Thermal Cycling (TC) High Temperature Stress (HTS), Biased Highly Accelerated Stress (bHAST), Power Temperature Cycling (PTC), Moisture Sensitivity Level (MSL), Vibration, and Mechanical stress tests etc
  • Collaborate with customers and internal teams to resolve any qualification issues or concerns that arise during testing and execution
  • Analyse qualification data to identify potential reliability risks and propose solutions
  • Lead failure analysis investigations for products that do not meet the qualification criteria
  • Provide insights and recommendations for product design or process improvements based on failure modes
  • Continuously improve the qualification process, applying best practices and lessons learned to enhance product reliability and accelerate time to market
  • Stay up-to-date with the latest industry standards, technological advancements, and customer-specific requirements

Qualifications :

  • Min 12+ years of experience in Reliability and Qualification Engineering within the Semiconductor IC development field
  • Experience with Automotive and Industrial product qualification standards, such as AEC-Q100 and JEDEC
  • Education :

  • Bachelor’s or Master’s degree in Electrical or Electronics Engineering, Semiconductor Engineering, Materials Science, or related field
  • Preferred qualifications :

  • In-depth knowledge of Automotive Qualification Standards (e.g., AEC-Q100) and industrial product reliability standards
  • Strong ability to develop and execute qualification plans for complex semiconductor products
  • Good understanding on Semiconductor Device Physics
  • Hands-on experience with various qualification tests (HTOL, ESD, MSL, etc.) and failure analysis methods
  • Proficient in failure analysis techniques and tools
  • Familiarity with reliability software tools for data analysis (Exensio, JMP, Spotfire etc) and test automation
  • Knowledge of statistical analysis techniques for reliability data (e.g., Weibull analysis) and reliability modelling software
  • Excellent problem-solving skills with a focus on customer requirements and product reliability
  • Strong communication skills, both written and verbal, to communicate effectively with customers, engineering teams, and management
  • Experience with automotive and industrial product certifications
  • Knowledge of ISO 26262 or similar safety-critical industry standards
  • Familiarity with semiconductor packaging technologies (e.g., flip-chip, wire bond, system-in-package (SiP))
  • Familiarity with design for reliability (DFR) methodologies and tools
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