Professional Skills :
- Minimum 10 years’ experience in designing Air cooled and conduction cooled electromechanical Enclosures and Chassis for defense / Avionics / Telecom industry.
- Experience in milled, sheet metal and plastic enclosure designs.
- Knowledge in 19-inch rack, ATR, VPX, JSS55555, DO-160, VME and ATCA standards.
- 10-years’ experience in Solid works / any design and drafting tools
- Knowledge of Structural and Thermal analysis.
- Ability to manage 2-member team
- As a Mechanical Engineer- Electronics Packaging specialist, you will be responsible for developing portions of the lithography system and / or associated tooling related to the electronics infrastructure.
- The position requires highly motivated, extremely organized and self-driven individuals. As a Mechanical Engineer- Electronics Packaging Specialist will :
- Perform mechanical design and development associated with packaging electronic circuits including, assembly design, analysis, test, and manufacturing introduction support for both new and existing electronics design projects.
- Understand and mitigate possible failure mechanisms associated with materials, interconnects, and environmental loads to develop a reliable design.
- Communicate with a team of multi-disciplined engineers (Systems , Electrical, Mechanical, Manufacturing, New Product Logistics, and Product Information Management) for design and logistic release approval.
- Investigate and edit product structures, generate CAD models, 2D / 3D drawings and be responsible for the final technical data package.
- Create, edit, review, and drive Engineering Changes to closure.
Self-Checking and Peer-Checking department designs and change notifications
Roles and Responsibility :
Ability to take up mechanical design independently.Interact with customers and project team, capture input and design accordingly.Design the components to meet DFM and DFA and customer requirement.Should be a team player.Ability to manage 2-member team.Mandatory Skill Set :
Minimum10 years’ experience in designing Air cooled and conduction cooled electromechanical Enclosures and Chassis for defense / Telecom industry.Proficiency in Solid works and AutoCAD.Good knowledge about BOM creation, material selection, Fastener selection, CNC machining and surface finish process.Vendor development activities.Desired Skill Set :
Knowledge in Structural and Thermal analysis.