Quality and Process Improvement Engineer

Location : TATA Semiconductor Assembly and Test, Jagiroad, India

Position Overview :

As a Process Engineer in an OSAT environment, you will play a pivotal role in developing, optimizing, and sustaining semiconductor packaging processes. You will be responsible for wire bonding, flip chip assembly, and integrated system packaging technologies, supporting both high-volume production and new product introductions (NPI). This role demands a strong technical foundation, hands-on experience with packaging equipment, and the ability to collaborate across cross-functional teams including R&D, quality, and customer engineering.

Key Responsibilities :

1. Process Development & Optimization

• Design and implement robust packaging processes including :
• Wire bonding (ball / wedge bonding, fine pitch, multi-row)
• Flip chip (underfill, reflow, thermal compression bonding)
• Integrated system packaging
• Conduct DOE (Design of Experiments) to optimize process parameters for yield, reliability, and throughput.
• Develop and maintain process documentation : SOPs, control plans, FMEAs, build sheets etc.

2. Manufacturing Support

3. New Product Introduction (NPI)

4. Equipment & Tooling Management

5. Quality & Compliance

Qualifications :

ability to work in a multicultural, fast-paced environment.

Preferred Skills :