WIFI Tech Lead Engineer

Role Summary :

RADWIN is seeking passionate Firmware Tech Lead Engineer with 5–8 years of experience in developing Wi-Fi firmware. The role involves working on embedded software development for Wi-Fi 6 / 7 chipsets, focusing on Upper MAC / Lower MAC, Data and Control Paths, and performance optimization within RTOS environments. You will be part of the new RADWIN Firmware Innovation Center in Chennai contributing to high performance wireless solutions.

Key Responsibilities : Design, implement, and maintain Wi-Fi firmware modules related to :

• Data Path and Control Path
• Upper MAC / Lower MAC / PHY integration
• Wi-Fi 6 and Wi-Fi 7 protocol enhancements
• Debug critical firmware issues impacting performance, stability, and throughput.
• Collaborate with hardware, RF, and systems teams to ensure optimal firmware operation across layers.
• Develop and optimize firmware for real-time embedded environments, ensuring compliance with timing constraints and system KPIs.
• Participate in code reviews, bring-up, and delivery of firmware to production hardware.
• Support regulatory (FCC, ETSI etc.,) and feature compliance (e.g., DFS, CCA, Spectral Scan, etc.).

Why Join RADWIN

Requirements :

Advantage :

If you are passionate to learn and contributing, we encourage you to apply even if you do not meet every 'Advantage' qualification listed above.

RADWIN is an equal opportunity employer. We evaluate qualified applicants without regard to race, gender, disability or any other legally protected characteristics.

Skills Required

Wireshark, Gdb, Sniffer, Embedded Software Development, Iperf, Debugging Tools