Module Lead - Embedded Hardware

Job description : Design, analyze, and validate high-speed electronic systems to ensure reliable signal transmission and robust power delivery across circuit boards, packages, and system-level designs

Work cross-functionally with hardware, PCB design, and package engineering teams to optimize electrical performance

Perform comprehensive SI / PI simulations, measurements, and troubleshooting to meet product performance requirements

Design and simulate PCB and package layouts for signal integrity and power integrity requirements

Perform end-to-end high-speed channel simulations including S-parameter extraction, eye diagram analysis, and compliance testing

Conduct power delivery network (PDN) analysis including target impedance calculations, decoupling capacitor optimization, and IR drop analysis

Develop and review design guidelines, stackup specifications, and interface requirements

Troubleshoot signal and power integrity issues in pre-silicon and post-silicon phases

Analyze high-speed interfaces (DDR3 / 4 / 5, PCIe Gen3 / 4 / 5, USB 2.0 / 3.X, HDMI, DisplayPort, SATA, Ethernet) for compliance and performance optimization

Document simulation results, test reports, and design recommendations for analysis.

Qualifications and skills needed :

Bachelor's or Master's degree in Electronics Engineering, or related field

3-5+ years of hands-on experience in SI / PI analysis and high-speed digital design

Deep understanding of electromagnetic theory, transmission lines, S-parameters, and impedance matching

S-parameter analysis, eye diagram interpretation, jitter analysis, and crosstalk evaluation

Target impedance calculation, decoupling strategy, plane design, and IR drop analysis

Experience Range : 3 to 8 years