Our Client is a leading a state-of-the-art OSAT (Outsourced Semiconductor Assembly and Test) facility. The facility specialize in advanced and legacy packaging services with a focus on display driver ICs (DDICs), wafer-level packaging (WLP), bumping for DDICs, wafer dicing / attach, and final test / assembly. The incumbent will lead all aspects of procurement, logistics, materials planning, vendor partnerships, and spare-parts strategy to enable world-class operations. Bachelor’s degree in Supply Chain Management, Engineering, Operations, or related field;MBA / PGDM preferred. 12+ years of leadership experience in supply chain management within semiconductors, electronics manufacturing services (EMS), OSAT / ATMP, or high-tech industries. Proven track record in establishing global supply chains, vendor development, and supplier risk management. Experience supporting greenfield manufacturing projects and ensuring CAPEX / OPEX readiness.