R&D - Image Sensor Head (Semiconductor)

About The Business Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’

Responsibilities

Lead team to develop and transfer to production CMOS Image Sensor technologies on a variety of nodes from 28nm-180nm

Work with Business / Product team to create financial / business justification for projects

Manage Project phase gates

Build and lead a high functioning team of diverse talents

Optimize the technology for a variety of parameters esp. Quantum Efficiency across wavelengths from 400-800nm, Pixel Size, Cross-talk, Dark current

Both BSI and FSI technologies will be required

Global and Rolling shutter capability will also be necessary

Design and Layout of test chips to aid in device / technology optimization, rel assessment and SPICE model extraction

Will assist in SPICE model and design kit creation

Core CMOS transistor performance will be maintained to enable 3T / 4T pixels and array designs

Work with designers to spec arrays that are competitive

Interface closely with customers at all phases of the technology development cycle

Present to customers, peers and executives

Travel will be required

Essential Attributes

Ability to manage semiconductor technology projects

Able to work independently, self-motivated with a strong drive to win.

Ability to work across diverse cross-functional teams spread across the world.

Good communicator with inclusive style

An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.

You’re a collaborative team player, building relationships, humbly offering support and openly welcoming approaches.

Innovative and creative, you proactively explore new ideas and adapt quickly to change.

Qualifications

M.S or PhD in Electrical Engineering, Materials Science or equivalent

Strong understanding of CMOS and eNVM device physics , process modules , yield improvement, failure mechanisms, analytical techniques (physical and electrical)

Proven leadership qualities in creating, managing and motivating a strong technical team and assisting in their development and career growth

Deep understanding of CMOS Image Sensor technologies and process modules

Understanding of CIS technology parameters and figures of merit

Proven track record in delivering these technologies into volume manufacturing

Familiarity with color filter coatings

Ability to work in cross-functional teams and achieve project completion within timeline and cost targets

Ability to work across different cultures and geographies

Good team player

Innovation and competitive mindset

Desired Experience Level

15+ years experience in the semiconductor industry, specifically in the image sensor field

Proven track record of successfully developing new technologies into high volume production

Proven problem solving skills using design of experiments and analytical tools