Position Summary :
The position is expected to be located at Plant . For leading the Shift rework activity for SMT & MI process
This position is responsible for Shift SMT / MI rework activity and testing failure part analysis with daily analysis of critical failure to improve First pass yeild
Responsibilities :
Lead the shift rework actvitity & coordinate with CFT to improve KPI
Job Responsibilities :
- Lead SMT & MI rework / repair activity in shift
- Handson experience in doing rework for Chip component, IC, BGA / LGA,connector & MI components
- Knowledge of IPC 7711 / 7721 along with IPC 610
- Debuging of ICT testing failure PCBA
- Handling of NG part end to end along with documentation.
- Monitor Daily first pass yield and quality issue data for SMT & THT process.
- On time analysis of failure part along with CFT to improve quality rate.
- Identify root cause and implement CAPA for failure along with CFT.
- Monitor All KPI on daily basis & timely escaltions when they arise aiming for minimum disruption
- Monitor & Co-ordinate with supplier quality team for supplier related issues.
- Encourage & motivate line operator for contineoul improvement.
- Maintain documentstion as per quality standard.
- Collaborate with quality control, Maintenence and SCM staff
- Meet the expectation of internal & external audits.
- Coordinate effective change management
Basic Qualifications :
Diploma with minimum 3 to 7 years of experience in SMT rework & repair
Skills Required
SMT MI rework, IPC 610, ICT testing, IPC 7711