Process Quality Engineer

Location : TATA Semiconductor Assembly and Test, Jagiroad, India

Position Overview :

As a Process Engineer in an OSAT environment, you will play a pivotal role in developing, optimizing, and sustaining semiconductor packaging processes. You will be responsible for wire bonding, flip chip assembly, and integrated system packaging technologies, supporting both high-volume production and new product introductions (NPI). This role demands a strong technical foundation, hands-on experience with packaging equipment, and the ability to collaborate across cross-functional teams including R&D, quality, and customer engineering.

Key Responsibilities :

1. Process Development & Optimization

Design and implement robust packaging processes including :

Wire bonding (ball / wedge bonding, fine pitch, multi-row)

Flip chip (underfill, reflow, thermal compression bonding)

Integrated system packaging

Conduct DOE (Design of Experiments) to optimize process parameters for yield, reliability, and throughput.

Develop and maintain process documentation : SOPs, control plans, FMEAs, build sheets etc.

2. Manufacturing Support

Provide real-time support to production lines to resolve process-related issues.

Monitor process KPIs such as yield, cycle time, defect rates, and equipment uptime.

Lead root cause analysis and implement corrective actions for maverick lots and customer returns.

3. New Product Introduction (NPI)

Collaborate with customer engineering and R&D teams to transfer new products from prototype to mass production.

Define tooling and equipment requirements for new packages.

Execute qualification plans including reliability testing.

4. Equipment & Tooling Management

Work with equipment vendors to install, calibrate, and maintain packaging tools (e.g., wire bonders, flip chip bonder, molding machines, etc.).

Drive automation and process standardization across multiple product lines.

5. Quality & Compliance

Ensure compliance with customer-specific requirements, JEDEC standards, and internal quality systems.

Support internal and external audits (ISO, customer audits, etc..).

Implement SPC and GR&R to monitor and control process stability.

Qualifications :

Bachelor’s or Master’s degree in Electronics, Mechanical, Materials Science, or related field.

5–10 years of experience in semiconductor packaging, preferably in an OSAT environment.

Hands-on experience with wire bonding, flip chip, and SiP technologies.

Proficiency in statistical tools (Minitab, JMP), SPC, and Six Sigma methodologies.

Strong analytical and problem-solving skills.

Excellent communication skills; ability to work in a multicultural, fast-paced environment.

Preferred Skills :

Experience with QFN, BGA, WLCSP, and other packages.

Familiarity with substrate design, thermal modeling, and mechanical stress analysis.

Knowledge of cleanroom protocols, ESD handling.