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Lead Physical Design Engineer

Lead Physical Design Engineer

ACL DigitalBengaluru, Karnataka, India
30+ days ago
Job description

Job Title : Lead Physical Design Engineer

Experience : 7+ Years

Location : Bangalore / Hyderabad

Employment Type : Full-time

Industry : Semiconductors / ASIC / VLSI / SoC Design

Job Summary :

We are seeking a highly experienced and technically strong Lead Physical Design Engineer to drive RTL-to-GDSII implementation for complex SoC or block-level designs. The ideal candidate will lead a team of engineers, oversee physical design execution, and ensure successful signoff and tapeout across advanced process nodes.

Key Responsibilities :

  • Own and drive block / full-chip physical implementation from RTL to GDSII.
  • Lead floorplanning, placement, clock tree synthesis (CTS), routing, and optimization.
  • Guide timing closure, power integrity (IR / EM), DRC / LVS, antenna, and reliability checks.
  • Define and execute physical design strategies to meet aggressive PPA targets.
  • Interface with cross-functional teams including RTL, STA, DFT, power, and package teams.
  • Plan and manage physical design activities for successful project delivery.
  • Implement low-power design techniques (multi-VDD, power gating) using UPF / CPF.
  • Drive physical design reviews, methodology development, and flow improvements.
  • Mentor and guide junior PD engineers; provide technical leadership and training.

Required Skills and Experience :

  • B.E / B.Tech or M.E / M.Tech in Electronics, Electrical Engineering, or VLSI.
  • 7+ years of strong experience in physical design implementation.
  • Hands-on experience with industry tools :
  • P&R : Synopsys ICC2, Cadence Innovus, Siemens Nitro
  • Timing : Synopsys PrimeTime
  • Verification : Calibre DRC / LVS, RedHawk, Tempus, Voltus
  • Strong command over timing analysis, congestion management, ECOs, and layout optimization.
  • Deep understanding of FinFET / advanced node design challenges (7nm / 5nm / 3nm).
  • Scripting skills (Tcl, Perl, Python) for design automation and tool integration.
  • Experience in tapeout and signoff processes with foundries like TSMC / Samsung / GF.
  • Preferred Qualifications :

  • Experience with hierarchical design and chip-level integration.
  • Exposure to 2.5D / 3D ICs, chiplets, HBM, or advanced packaging technologies.
  • Knowledge of DFT insertion and formal verification tools.
  • Familiarity with EDA tool flows customization and methodology development.
  • Interested can share Cv to

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