Key Responsibilities:
- Team Leadership & Development: Lead, mentor, and develop teams of high-speed PCB design and simulation managers and engineers, focusing on their career growth and skill development.
- Strategic Design and Simulation: Define and implement high speed design and simulation roadmaps, methodologies and best practices for signal integrity, power integrity, electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal analysis.
- Cross-Functional Collaboration: Work closely with hardware, firmware, mechanical, and manufacturing teams to translate requirements into viable designs and resolve issues.
- Project & Resource Management: Oversee the management of multiple complex PCB design and simulation projects, ensuring they meet deadlines, budget requirements, and performance targets.
- Technical Oversight: Provide technical guidance on PCB layout, schematic creation, and component selection, staying current with new technologies and design standards.
- Design review and verifications: Conduct design and simulation reviews, providing strategic recommendations to optimize PCB performance and reliability.
- Continuous improvement: Drive innovation and improvement in high-speed PCB design and simulation process. Stay current with emerging technologies, design standards (e.g. IPC), and simulation tools to enhance efficiency and maintain a competitive edge.
- Quality and Validation: Lead and drive accuracy in design and simulations, conduct design of experiments (DoE), plausibility check and sensitivity study of simulations, validate simulation results with experimental data, and design optimizations for first time right manufacturability (prototypes and mass production).
Qualification and Skills:
- Education: A bachelors degree in electrical or electronics engineering from a premier institute/university. A masters degree in a related field is preferred.
- Experience: 20 yrs extensive hands-on experience in high-speed PCB design and simulation with a proven track record of delivering complex projects.
- Leadership: 8-10 years progressive leadership or management experience in leading and developing high-performing engineering teams. Experience in customer engagement and stakeholder management is essential.
Technical Skills:
- Deep understanding of engineering principles for high-speed PCB design, signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents.
- Deep understanding of PCB layout, schematic creation, routing, and manufacturability.
- Expertise in high-speed PCB design tools such as Altium Designer, Allegro or PADS.
- Expertise in high-speed PCB simulation tools for electrical and thermal analysis - Ansys SIwave/HFSS, Keysight Pathwave ADS, Keysight SIPro, Siemens HyperLyx, Cadence Sigrity, Dassault CST Studio Suite, Ansys EMC Plus, Cadence Microwave Office, and Ansys ICEPAK/Siemens FLOTHERM/Cadence CELSIUS.
- Strong knowledge of industry standards (IPC, JEDEC, PCIe, USB, Ethernet) and PCB manufacturing processes, including design for manufacturability (DFM).
(ref:hirist.tech)