Principal Analog IC Design Lead Custom PMIC & Mixed-Signal

The world's most iconic mobile devices are powered by chips designed by teams like this one. We're looking for an analog IC design leader who's ready to build, mentor, and ship the chips that power the next generation of personal electronics.

About the Role

Texas Instruments' Custom Product Business is one of the most technically ambitious teams in the global semiconductor industry — delivering industry-leading custom IC system solutions for the world's top mobile electronics brands. Our portfolio spans display and touch power products, charger ICs, camera PMICs, power switches/muxes, laser drivers, and high-speed communication interfaces.

We're hiring a Principal Analog IC Design Lead who brings deep mixed-signal expertise, proven leadership instincts, and the drive to own complex PMIC programs from first spec to final silicon. This isn't a role for someone who wants to follow a roadmap — it's for someone who wants to write one.

You'll lead cross-functional design teams, interface directly with Tier-1 customers, and contribute hands-on to transistor-level design — all while building a culture of technical excellence and design quality that sets the standard for the industry.

Key Responsibilities

• Direct, guide, and hands-on participate in designing, developing, and evaluating complex analog/mixed-signal ICs — including PMICs, LDOs, switching regulators, charge pumps, ADCs, DACs, amplifiers, bandgaps, and comparators
• Lead cross-functional teams — making assignments, setting design schedules, monitoring progress, and managing scarce project resources with precision
• Own block/project end-to-end — from architecture definition and circuit design through silicon evaluation, validation, and production transfer
• Conduct worst-case analysis, Monte Carlo simulation, and post-layout parasitic extraction to ensure all IC-level performance metrics are met
• Collaborate with physical layout designers, providing guidance on routing trade-offs, signal grounding, and die area optimization
• Work closely with Design Verification, Validation, Product Engineering, and Test Engineering teams to ensure smooth pre-PG completion and production handoff
• Partner with Systems, Applications, and Marketing teams to define product specs, prepare datasheets, application notes, and contribute to roadmap creation
• Lead and manage customer interactions — representing TI's technical capabilities in direct customer meetings with Tier-1 mobile OEMs
• Actively participate in hiring, mentoring, and developing engineering talent within the team

Required Skills

• Bachelor's degree in Electrical Engineering or related field
• 5–15 years of experience in analog/mixed-signal IC design with demonstrated team leadership
• Proven expertise in transistor-level design of analog building blocks: amplifiers, bandgaps, comparators, LDOs, charge pumps, ADCs, DACs, switching regulators
• Strong command of SPICE/Spectre simulation and working knowledge of Cadence CAD toolset
• Ability to perform hand analysis (pen-and-paper) as well as simulation-driven design validation
• Track record of mentoring and guiding teams through complex IC programs on aggressive schedules
• Experience with IC system partitioning, signal chain analysis, and architectural trade-off analysis
• Self-directed with full block/project ownership capability — from spec to silicon to production
• Excellent verbal and written communication skills; comfortable in customer-facing technical meetings

Preferred Qualifications

• Deep expertise in BCD process technologies for power IC design
• Experience with VHDL, co-simulation (Cosim), and top-down IC design methodologies
• Strong understanding of semiconductor IC processing, advanced packaging, and production test solutions
• Background in IC physical layout management — routing trade-offs, grounding strategies, die area optimization
• Experience with top-level simulation, block-level modeling, and system-level verification
• Knowledge of mixed-signal IC design for mobile applications — camera PMICs, display power, charger ICs
• Familiarity with production yield targets, testability, and design-for-test (DFT) considerations
• Proven ability to work directly with Tier-1 customers in joint product definition and qualification cycles

Why Join Texas Instruments

Work on the Chips Inside the World's Most Iconic Devices TI's Custom Product Business serves the global Tier-1 mobile electronics market. Your designs will power devices seen, used, and trusted by hundreds of millions of people worldwide.

Technical Depth + Leadership Opportunity This role is rare — it demands both hands-on analog design mastery and team leadership capability. TI rewards engineers who can do both, with clear paths to Senior Engineer, Lead Engineer, and Technical Fellow tracks.

A Team That's Genuinely World-Class You'll be joining what we believe is the best custom semiconductor team on the planet — a group defined by ingenuity, ambition, and a relentless drive to deliver.

Real Ownership, Real Accountability From customer interaction to silicon tape-out, you'll have complete program ownership — the kind of responsibility that accelerates careers.

Competitive Compensation TI offers market-leading salaries, long-term incentives, comprehensive benefits, and the financial stability of a global Fortune 500 semiconductor leader.

Culture of Learning & Mentorship TI invests deeply in its people — with structured mentorship, technical development programs, and a culture that values both growing and giving back.

Call to Action

Great analog engineers are rare. Great analog leaders who can also mentor, own programs, and win with customers are extraordinary.

If that's you — Apply now.

Skills Required
advanced packaging, analog mixed-signal IC design, architectural trade-off analysis, BCD process technologies, block-level modeling, Cadence CAD toolset, hand analysis, IC physical layout management, IC system partitioning, mixed-signal IC design for mobile applications, production test solutions, production yield targets, semiconductor IC processing, signal chain analysis, SPICE Spectre simulation, system-level verification, top-down IC design methodologies, top-level simulation, transistor-level design, VHDL co-simulation