Principal Product Engineer Digital & Signoff Group (DSG)
Location: Bangalore
Team: Cadence DSG (Digital & Signoff Group)
The Opportunity
Join Cadences Digital and Signoff Group (DSG) as a Product Engineer where you will act as the vital bridge between R&D Application Engineering and our global this high-impact role you will influence the next generation of chip design software helping industry leaders solve complex physical design challenges at 7nm and below.
Key Responsibilities
Technical Expert: Serve as the primary place-and-route (P&R) resource for internal development teams and external customers. Product Evolution: Collaborate with R&D to track diagnose and resolve software issues ensuring a robust tool release cycle. Design Benchmarking: Execute competitive benchmarks to demonstrate Cadences edge in Power Performance and Area (PPA). Flow Innovation: Develop and deploy customized RTL-to-GDSII methodologies and scripts to meet specific customer design goals. Strategic Collaboration: Partner with Product Marketing to align technical capabilities with market needs and customer roadmaps.
Requirements
Education:
Bachelors in Electronics Engineering (EE) 6 or more years of industry experience
OR
Masters in Electronics Engineering (EE) 4 or more year of digital implementation experience.
Core Expertise: Deep understanding of the full ASIC design flow (RTL-to-GDSII) with a focus on physical design and timing analysis. Advanced Node Experience: Proven hands-on experience with timing closure and PPA optimization at 7nm 5nm or below. Tool Proficiency: High familiarity with industry-standard EDA tools for synthesis placement routing and signoff. Scripting Skills: Proficiency in Tcl Python or Perl (familiarity with AI-driven productivity tools is a major plus).
Communication: Strong verbal and written skills to translate complex technical issues into actionable solutions.
Required Experience:
Staff IC
Principal Product Engineer – Digital & Signoff Group (DSG) • Bengaluru, Karnataka, India
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