Lead Physical Design & Integration Engineer

Role : Sr Physical Design Lead / BE Integration

This position is for senior level engineer Full Chip Physical Design / Integrations / SoC Floor planning / Bump Planning / Pin Assignments / Feed through / LFU Optimization / Physical Verification, Power design / implementation / signoff. He must have hands on Physical Design experience and must have handled RTL to GDS II at Top level

Key Responsibilities :

• Expertise in hierarchical RTL2GDSII design implementation
• Expertise in pin assignment, Power planning, IO / Bump Planning, Pad Ring Creation, Die File Creation, RDL Routing, working with Package Team for Optimize the Bumps
• Full chip Hierarchical Floor Planning, Block planning, block level constraints, hierarchical clock tree implementation, block integration and chip finishing for Analog-Mixed Signals.
• Experience in debugging LVS issues at chip-level with complex analog-mixed signal IPs
• Low power design with power estimation / optimization including clock gating, power gating, power switch implementation and other low power techniques to reduce total power consumption.
• excellent debugging skills
• Expertise in FC (Fusion Compiler)
• Expertise in Primetime, Calibre for DRC / LVS, Ansys Redhawk EMIR
• Soft Skills –
• Should be able to drive decision with cross functional Teams.
• Good Communication Skills

Academic Credentials

Bachelors or Master's degree in Computer / Electronics / Electrical Engineering