Full Chip Physical Design Engineer
Job Summary :
We are seeking a highly motivated and skilled engineer to join our SoC implementation team. You will be responsible for the physical design of complex ASICs and SoCs, working on full-chip floorplanning, integration, and signoff activities to meet aggressive PPA (Power, Performance, Area) goals.
Key Responsibilities :
- Drive full chip-level physical design flow from RTL to GDSII.
- Ownership of chip-level floorplanning, partitioning, and integration.
- Collaborate with RTL, synthesis, DFT, and STA teams to resolve cross-functional issues.
- Implement place & route flows including timing closure, IR / EM, and congestion optimization.
- Perform physical verification (LVS / DRC / ERC) and work with foundries to fix violations.
- Manage static timing analysis (STA) at top level and work closely with timing owners for signoff.
- Handle power planning and power domain implementation (UPF / CPF-based).
- Contribute to methodology improvements and automation.
Required Qualifications :
Bachelor's or Master’s degree in Electrical / Electronics / Computer Engineering or related field.3–6 years of experience in physical design with at least one full chip tapeout.Hands-on expertise with industry-standard tools such as Synopsys (ICC2, Fusion Compiler, PrimeTime), Cadence (Innovus), and Mentor (Calibre).Strong knowledge of physical design concepts : floorplanning, CTS, routing, timing closure, IR drop, EM, DRC / LVS.Proficiency in scripting languages like Tcl, Perl, Python, or Shell.Familiarity with hierarchical design and ECO flows.Experience : 3 to 6 Years.
Location : Bangalore / Hyderabad .
Notice Period : Less than 30 days