Process Lead - OSAT Semiconductor Packaging

Position Overview :

The Manufacturing Engineer will be responsible for overseeing and optimizing backend semiconductor manufacturing processes, including wire bonding, flip chip assembly, integrated system packaging, and testing. This role is critical in ensuring high-yield, cost-effective, and scalable production in a high-volume OSAT environment. The engineer will collaborate with cross-functional teams including process engineering, quality, equipment, and customer engineering to support new product introductions (NPI), continuous improvement, and production ramp-up.

Key Responsibilities :

1. Manufacturing Process Ownership

Lead daily operations for wire bond, flip chip, Integrated System Packaging, and test processes.

Monitor and control process KPIs : yield, cycle time, throughput, and defect rates.

Drive root cause analysis and corrective actions for yield excursions and quality issues.

2. New Product Introduction (NPI)

Support NPI

activities by coordinating with R&D and customer teams.

Ensure smooth transition from engineering builds to mass production.

Validate process capability and reliability through qualification plans.

3. Equipment & Tooling Support

Work with equipment engineering to install, calibrate, and maintain backend tools (e.g., wire bonders, flip chip bonders, testers).

Define tooling requirements and support tool buy-off and acceptance.

Optimize equipment utilization and reduce downtime.

4. Quality & Compliance

Ensure compliance with customer specifications, JEDEC standards, and internal quality systems.

Participate in internal and external audits, support documentation and traceability.

Implement SPC, FMEA, and control plans to maintain process stability.

5. Continuous Improvement

Lead yield improvement, cost reduction, and cycle time optimization projects.

Collaborate with cross-functional teams to implement Lean and Six Sigma methodologies.

Drive automation and digitalization initiatives (e.g., MES integration, data analytics).

6. Test Engineering Interface

Coordinate with test engineering to ensure proper test coverage and correlation.

Support test program development, handler setup, and strategies.

Analyse test data to identify process-related failures and drive improvements.

Qualifications :

Bachelor’s or Master’s degree in Electronics, Mechanical, Manufacturing Engineering.

8+ years of experience in semiconductor backend manufacturing, preferably in OSAT environments.

Hands-on experience with wire bonding (ball / wedge), flip chip attach, molding, and electrical test.

Proficiency in SPC, DOE, Six Sigma, and data analysis tools (e.g., JMP, Minitab).

Strong communication and project management skills.

Preferred Skills :

Experience with QFN, BGA, WLCSP, and Integrated System packaging.