Vice President Of Global Supply Chain

Our Client is a leading a state-of-the-art OSAT (Outsourced Semiconductor Assembly and Test) facility. The facility specialize in advanced and legacy packaging services with a focus on display driver ICs (DDICs), wafer-level packaging (WLP), bumping for DDICs, wafer dicing / attach, and final test / assembly. The incumbent will lead all aspects of procurement, logistics, materials planning, vendor partnerships, and spare-parts strategy to enable world-class operations.

• Bachelor’s degree in Supply Chain Management, Engineering, Operations, or related field;

MBA / PGDM preferred.