Staff PCB - Package co-design Engineer

Looking for your next career challenge We seek an experienced Electronics Engineer specializing in PCB Silicon packaging co-design to join Arm's Packaging, Boards and Multiphysics team. You will be involved with systems that incorporate Arm processors, focusing on aspects like chip packaging and System-on-Chip (SoC) integration. We develop physical hardware platforms used for software development and validation activities for both external partners / customers and our internal development teams. The team is working at the forefront of embedded compute focusing on prototyping Arm's latest IP products.

Responsibilities

Collaborate with engineering teams across multiple geographies to specify, evaluate, analyze and develop solutions for optimal PCB and silicon package integration. Focus on driving the PCB development alongside the chip packaging team, including brainstorming breakout and routing strategies, design rules and layer optimization to ensure optimal performance, reliability, and cost-effectiveness. Provide timescale estimates and justifications into the program team.

Required Skills And Experience

• Strong understanding of electronics and embedded compute systems.
• Familiarity with different IC packaging technologies and their impact on PCB design to ensure seamless integration of SoCs, ensuring proper signal routing and power delivery.
• Experience of collaborating with chip packaging teams. Ability to influence and drive SoC device pin-outs for cost optimization, routing feasibility and layer trade-off analysis.
• Detailed knowledge of high-speed design and interface standards (e.g. PCIe and DDR memory technologies). You'll analyze and optimize signal paths to ensure signal quality, minimize noise, and prevent signal degradation, especially at high speeds.
• Expertise in escape routing analysis of high density SoC's and able to provide estimates of the IO count that can be routed with a particular stack-up and design rule set.
• Extensive knowledge of Signal and Power Integrity analysis techniques from both board design and chip packaging perspectives.
• Understanding of the PCB fabrication process (PTH and HDI), stackup / VIA topologies and substrate materials. Ability to collaborate with PCB fabricators and CEMs.
• Proficiency in the use of EDA tools, specifically Cadence Allegro PCB suite and OrCAD CIS.
• Good communication and interpersonal skills. Positive can-do attitude and attention to detail.

Desirable Skills and Qualities

The following skills are not essential, but experience in any of the following areas would enhance the application :

In Return :

You will gain a deeper understanding of high-performance compute platforms! You'll be working alongside other engineering teams, in a friendly supportive environment collaborating with highly motivated, like minded engineers, producing high quality designs incorporating Arm IP. You will enjoy new technical challenges faced when using advancing technologies!

Accommodations at Arm

At Arm, we want to build extraordinary teams. If you need an adjustment or an accommodation during the recruitment process, please email [HIDDEN TEXT] . To note, by sending us the requested information, you consent to its use by Arm to arrange for appropriate accommodations. All accommodation or adjustment requests will be treated with confidentiality, and information concerning these requests will only be disclosed as necessary to provide the accommodation. Although this is not an exhaustive list, examples of support include breaks between interviews, having documents read aloud, or office accessibility. Please email us about anything we can do to accommodate you during the recruitment process.

Hybrid Working at Arm

Arm's approach to hybrid working is designed to create a working environment that supports both high performance and personal wellbeing. We believe in bringing people together face to face to enable us to work at pace, whilst recognizing the value of flexibility. Within that framework, we empower groups / teams to determine their own hybrid working patterns, depending on the work and the team's needs. Details of what this means for each role will be shared upon application. In some cases, the flexibility we can offer is limited by local legal, regulatory, tax, or other considerations, and where this is the case, we will collaborate with you to find the best solution. Please talk to us to find out more about what this could look like for you.

Equal Opportunities at Arm

Arm is an equal opportunity employer, committed to providing an environment of mutual respect where equal opportunities are available to all applicants and colleagues. We are a diverse organization of dedicated and innovative individuals, and don't discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.

Skills Required

Signal and Power Integrity analysis techniques, Electronics and embedded compute systems, IC packaging technologies