Head Power Technologies (BCD) - Semiconductor

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.

Integration responsibilities for transfer of 40-110nm BCD and HV (Display Driver) technologies from partner facilities while achieving performance, reliability, yield, schedule and cost targets. Support initial ramp while maintaining yield and quality metrics.

Add features (active devices and passives) to existing technologies and create new technologies that will improve performance and extend application range

Responsibilities may extend to leading Wide Band Gap Power technologies

Design and Layout of test chips to aid in device / technology optimization, rel assessment and SPICE model extraction

End to end Project Management from initial project justification to final qualification and yield ramp with responsibilities for achieving desired performance, quality / yield, schedule and cost targets.

• Build and lead a cross functional team across diverse geographies
• Build strong customer relationships based on confidence in TEPL technical capabilities
• Competitor benchmarking; ownership of technology roadmap
• Presentation to internal and customer senior executives
• Travel (few weeks per quarter)
• Ability to manage, mentor, and lead a team of highly motivated professionals.
• Able to work independently, self-motivated with a strong drive to win.
• Team player with the ability to work across diverse cross-functional teams spread across the world.
• Leadership skills to influence all levels of the organization.
• You’re inclusive, adapting your style to the situation and diverse global norms of our people.
• An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
• You’re collaborative, building relationships, humbly offering support and openly welcoming approaches.
• Innovative and creative, you proactively explore new ideas and adapt quickly to change.

1. M.S or PhD in Electrical Engineering, Materials Science or equivalent

2. Strong understanding of CMOS and Power device physics, process modules, yield improvement, failure mechanisms, analytical techniques (physical and electrical)

3. Understanding of EDMOS / LDMOS device design trade-offs using resurf and superjunction concepts

4. Deep knowledge of power technology parameters and figures of merit (Rsp, RonQg, SOA, etc); experience in achieving competitive performance

5. Proven track record in delivering these technologies into volume manufacturing

6. Understanding of key modules especially as they pertain to power technologies (eg. Epi, Implant) and understanding of different power device configurations (eg. Isolated vs Non Isolated devices)

7. Ability to lead cross-functional teams and achieve project completion within timeline and cost targets

8. Ability to work across different cultures and geographies

9. Good team player

10. Innovation and competitive mindset

15+ years experience in the semiconductor industry

Proven track record of successfully developing new technologies into high volume production

Proven problem solving skills using design of experiments and analytical tools