Process Lead - OSAT Semiconductor Packaging

Position Overview :

The Manufacturing Engineer will be responsible for overseeing and optimizing backend semiconductor manufacturing processes, including wire bonding, flip chip assembly, integrated system packaging, and testing. This role is critical in ensuring high-yield, cost-effective, and scalable production in a high-volume OSAT environment. The engineer will collaborate with cross-functional teams including process engineering, quality, equipment, and customer engineering to support new product introductions (NPI), continuous improvement, and production ramp-up.

Key Responsibilities :

1. Manufacturing Process Ownership

• Lead daily operations for wire bond, flip chip, Integrated System Packaging, and test processes.
• Monitor and control process KPIs : yield, cycle time, throughput, and defect rates.
• Drive root cause analysis and corrective actions for yield excursions and quality issues.

2. New Product Introduction (NPI)

3. Equipment & Tooling Support

4. Quality & Compliance

5. Continuous Improvement

6. Test Engineering Interface

Qualifications :

Preferred Skills :