Hardware Eng Manager

This job requires the individual to work with global stakeholders and manage the Mechanical Team and Project Engineering Team. He / She needs to have hands on experience on various Mechanical engineering aspects with apt experience in Project engineering as well. Overall drive program performance to manage program cost, schedule, technical risks and dependencies. The individual needs to be the driving force behind the success of NPIs & Obsolescence and accomplish the goals with detailed work plans, manage teams, achieve milestones, establish day-to-day priorities and communicate the result across the global stakeholders. The Platforms Center-of-Excellent Engineering team includes diverse teams like Software, Electrical, Mechanical, Board layout, Component engineering and FPGA / ASIC teams and you will coordinate all of them with our customer programs to ensure Mechanical and Project Engineering functions are seamlessly integrated and deliver per program goals.

• Maintain, drive, supervise, and implement a robust technical design process and guidelines.
• Develop global competencies and grow the level of expertise in the team.
• Influence technology strategies and choices with a high level of expertise and knowledge.
• Drive strategic objectives and goals of the organization.
• Work with global cross-functional teams to develop and drive common processes, tools, and cycle time reduction processes.
• Interface with ISC, domestic stakeholders as well as external customers / suppliers, chief engineers, and subject matter experts to ensure the functional / program objectives are achieved.
• Be a growth enabler, have an entrepreneurial mindset, and create IP portfolios through innovation.
• Ability to interact and work effectively with individuals at all levels.
• Excellent written and oral communication skills.
• Manage program health and overall status of cost, schedule and risks via PE team
• Addresses barriers and bring down re-occurring and non-reoccurring costs in engineering
• Experience in enclosure Design & Electronics Packaging Engineering (SWaP-C, Compact Packaging, reduced weight, boundary conditions, Usability aspects, low cost, DTC Design to Cost, Reduced number of parts, should costing, BOM Analysis, Weight Analysis)
• Significant experience in engineering, especially familiarity with Aerospace product development process and practices
• Knowledge in Thermal & Structural Analysis (Power dissipation requirements, Thermal mass, boundary condition, CFD - Computational Fluid Dynamics, air flow / ventilation, passive / forced cooling, loss of cooling, thermal reliability of components for given worst case condition & meet functional requirements, chassis ruggedness against various vibration applications / requirements)
• Experience in Value Engineering, Field issues management, manufacturing, RCCA, Analysis & Fixing (DFX - Design for Assembly / Manufacturability / Inspection / Tooling, Fixture Design for test / manufacturing, Analyze field / factory issues for Design / process / workmanship / test issues and address via RCCA, etc.,)
• Exposure in System Engineering & Certification aspects - (Understand System Reqs, System Integration, Certification requirements - DO-160 / D6 / Mil-Std-810 Design aspects for Environmental & EMI / EMC requirements, FRACA - Failure Root cause Analysis & Corrective Action)
• Quality & Execution Excellence - (Accountable for driving Quality & Execution of Programs. Build strong MOS with internal (project teams, peers, engineering COEs) and external stakeholders). Building continuous improvement culture driving reduction in cycle time (Lean Product Dev, Agile Practices Deployment)
• Leadership Skills (Decision Making, Self Driven, Initiative, Taking Accountability of failures, Transparency in dealing with customers and team members, Lead Org Level Initiative- SDP)
• Guide PE on schedule alignment, scope definition, budget estimation, implementation plans and risks mitigation.

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