[Apply Now] Senior Engineer, Signal and power integrities

Job Title : Senior Engineer, Package Design (SI / PI)

Location : Bengaluru , India

Type : Full-Time Direct Hire

The client is seeking a Senior Engineer, Package Design to work from our Bengaluru, India office.

Responsibilities

The Package substrate design focuses on signal and power integrities analyses as well as routing analyses. You will be reporting to the Director of Package Design (USA) and working very closely with the Package design team in our parent company’s headquarters in Japan and Marketing and Engineering teams located in our Milpitas office during the pre / post sales process.

This position requires a broad knowledge of package technology and design. Successful candidates will have a deep understanding and experience in the following areas : high performance build-up substrates, flip chip assembly or 2.5D packaging. Knowledge and experience in extracting / simulating package designs for Signal and Power integrities using tools such as HFSS, and / or ADS tools.

Education

• Bachelor’s degree in Electrical Engineering, or other semiconductor packaging related discipline
• MS is preferred
• Required Experience and Skills
• 8 to 10 years of experience in semiconductor packaging design, modeling, extraction, and simulations
• Record of success in cross-functional team environment
• Good experience with Signal and power integrity tools for package level modeling / extraction / simulation
• Ability to work with Package Layout engineers.
• Strong presentation and communication skills

Preferred Experience and Skills