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[25 / 10 / 2025] Principal Engineer – Chip Design Back End

[25 / 10 / 2025] Principal Engineer – Chip Design Back End

Toshiba Software (India) Pvt. Ltd.India
12 hours ago
Job description

Job Overview : As a Backend (Physical Design) Principal Engineer specializing in Semiconductor Chip Design, you will lead and coordinate the execution of the back-end stages of integrated circuit development. This role requires a strong technical background in physical design, a deep understanding of semiconductor processes, and exceptional project management skills. You will oversee teams engaged in physical design, synthesis, DFT, place and route, power integrity, and other back-end aspects to ensure the successful realization of semiconductor designs. Additionally, you will oversee product support activities for both Pre-production and Post-production stages, ensuring the successful initiation, development, and sustainment of semiconductor designs.

Required Skills & Experience

  • Min 8+ years of strong experience in backend flows for MCU or low-power SoC designs.
  • Ability to lead the DFT teams, Physical and formal Verification Teams.
  • Exposure to frontend and Analog processes.
  • Ability to collaborate effectively with frontend and analog teams
  • Experience in Product Support for both Pre and Post Production Stages, Support for RMA teams.

Preferred Skills and Experience

  • Min 1+ years of Project Management (Waterfall and Agile – Hybrid Methodology).
  • Continuous Improvement.
  • Knowledge of industry standards and best practices in semiconductor front-end design.
  • Qualifications :

    Masters in VLSI design from reputed universities like IIT / NIT with a background in Bachelors in Electronics and Communication, or a related field.

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    [25/10/2025] Principal Engineer – Chip Design Back End • India

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