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Lead Physical Design Engineer
Lead Physical Design EngineerBlueberry Semiconductors • Solapur, IN
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Lead Physical Design Engineer

Lead Physical Design Engineer

Blueberry Semiconductors • Solapur, IN
1 day ago
Job description

JD for a Physical Design Lead (Sub-3 nm, TSMC, 8–10 yrs, Synopsys / Cadence)

Job Title

Physical Design Lead – Advanced Node (Sub-3 nm, TSMC)

Location : Bangalore

Experience : 8+ to 12 years

Job Mode : Full Time

Position Summary

Lead end-to-end physical implementation and signoff for complex SoC blocks or subsystems at advanced nodes (5 nm, 3 nm and below), using Synopsys and / or Cadence tool flows, preferably, targeting TSMC technologies. Own PPA and signoff closure for

multi-million instance designs and drive successful production tape-outs while leading and mentoring a local PD team.

Key Responsibilities

  • Own complete physical design flow (floor planning, power planning, placement, CTS, routing, optimization, ECOs) for high-complexity blocks / subsystems with multi-million standard-cell instances (10M+ gate equivalent) across multiple clock and power domains.
  • Drive timing signoff and closure using Synopsys PrimeTime (PT) and / or Cadence Tempus in MMMC environments, including CPPR, AOCV / POCV, on-chip variation, and path-based analysis. Knowing Power aware timing analysis is a plus.
  • Define and implement Power Delivery Network (PDN) at block and top level : power grid topology, straps, via ladders, mesh / tree hybrids, and decap strategy; coordinate with package / board power-integrity teams.
  • Own IR drop and EM signoff (static and dynamic) using tools such as Ansys RedHawk, Cadence Voltus or equivalent ; debug hotspots and drive fixes to meet voltage droop, current-density, and reliability specs at advanced TSMC nodes.
  • Manage physical verification and manufacturability signoff (DRC, LVS, ERC, antenna, density / fill, SI, reliability) using foundry decks and tools such as Mentor Calibre, Cadence Pegasus .
  • Implement and optimize low-power design techniques : multi-VDD domains, UPF / CPF power intent, power / clock gating, retention, level shifters, isolation cells, and state retention aligned with TSMC low-power guidelines.
  • Interface with TSMC PDKs, reference flows and tape-out processes , ensuring adherence to design rule manuals and signoff checklists; prepare and review signoff reports for tape-out.
  • Provide technical leadership to PD engineers : task planning, code and constraint reviews, methodology enforcement, and cross-team coordination with RTL, DFT, STA, PDN, packaging, and global counterparts.

Required Skills and Experience

  • 8–10 years of ASIC physical design experience with multiple production tape-outs at 7 / 5 / 3 nm or below , preferably on TSMC N7 / N5 / N3 / N2 nodes.
  • Proven ownership of SoC blocks / subsystems of multi-million standard-cell instances / multi-tens-of-million gate equivalent , including timing, congestion, power, and area closure.
  • Strong hands-on experience with one or more of the following tool chains :
  • o    Synopsys flow : Design Compiler / Fusion Compiler or ICC2, PrimeTime, RedHawk / PrimePower or equivalent.

    o    Cadence flow : Genus, Innovus, Tempus, Voltus.

  • Deep understanding of advanced-node challenges : complex DRC, EUV layers, parasitics, large MMMC space, variation and derates, and their impact on timing, IR, noise, and yield.
  • Demonstrated ability in PDN planning and EMIR closure , including correlation to silicon where available.
  • Strong scripting skills in Tcl and / or Python for flow automation, report parsing, and methodology development.
  • Education and Soft Skills

  • B.E. / B.Tech or M.E. / M.Tech in ECE / EEE / VLSI or related discipline from a recognized institute.
  • Excellent communication and collaboration skills to work with cross-site, cross-functional teams; strong ownership mindset and ability to drive issues to closure under aggressive schedules.
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    Lead Design Engineer • Solapur, IN

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