JD for a Physical Design Lead (Sub-3 nm, TSMC, 8–10 yrs, Synopsys / Cadence)
Job Title
Physical Design Lead – Advanced Node (Sub-3 nm, TSMC)
Location : Bangalore
Experience : 8+ to 12 years
Job Mode : Full Time
Position Summary
Lead end-to-end physical implementation and signoff for complex SoC blocks or subsystems at advanced nodes (5 nm, 3 nm and below), using Synopsys and / or Cadence tool flows, preferably, targeting TSMC technologies. Own PPA and signoff closure for
multi-million instance designs and drive successful production tape-outs while leading and mentoring a local PD team.
Key Responsibilities
- Own complete physical design flow (floor planning, power planning, placement, CTS, routing, optimization, ECOs) for high-complexity blocks / subsystems with multi-million standard-cell instances (10M+ gate equivalent) across multiple clock and power domains.
- Drive timing signoff and closure using Synopsys PrimeTime (PT) and / or Cadence Tempus in MMMC environments, including CPPR, AOCV / POCV, on-chip variation, and path-based analysis. Knowing Power aware timing analysis is a plus.
- Define and implement Power Delivery Network (PDN) at block and top level : power grid topology, straps, via ladders, mesh / tree hybrids, and decap strategy; coordinate with package / board power-integrity teams.
- Own IR drop and EM signoff (static and dynamic) using tools such as Ansys RedHawk, Cadence Voltus or equivalent ; debug hotspots and drive fixes to meet voltage droop, current-density, and reliability specs at advanced TSMC nodes.
- Manage physical verification and manufacturability signoff (DRC, LVS, ERC, antenna, density / fill, SI, reliability) using foundry decks and tools such as Mentor Calibre, Cadence Pegasus .
- Implement and optimize low-power design techniques : multi-VDD domains, UPF / CPF power intent, power / clock gating, retention, level shifters, isolation cells, and state retention aligned with TSMC low-power guidelines.
- Interface with TSMC PDKs, reference flows and tape-out processes , ensuring adherence to design rule manuals and signoff checklists; prepare and review signoff reports for tape-out.
- Provide technical leadership to PD engineers : task planning, code and constraint reviews, methodology enforcement, and cross-team coordination with RTL, DFT, STA, PDN, packaging, and global counterparts.
Required Skills and Experience
8–10 years of ASIC physical design experience with multiple production tape-outs at 7 / 5 / 3 nm or below , preferably on TSMC N7 / N5 / N3 / N2 nodes.Proven ownership of SoC blocks / subsystems of multi-million standard-cell instances / multi-tens-of-million gate equivalent , including timing, congestion, power, and area closure.Strong hands-on experience with one or more of the following tool chains :o Synopsys flow : Design Compiler / Fusion Compiler or ICC2, PrimeTime, RedHawk / PrimePower or equivalent.
o Cadence flow : Genus, Innovus, Tempus, Voltus.
Deep understanding of advanced-node challenges : complex DRC, EUV layers, parasitics, large MMMC space, variation and derates, and their impact on timing, IR, noise, and yield.Demonstrated ability in PDN planning and EMIR closure , including correlation to silicon where available.Strong scripting skills in Tcl and / or Python for flow automation, report parsing, and methodology development.Education and Soft Skills
B.E. / B.Tech or M.E. / M.Tech in ECE / EEE / VLSI or related discipline from a recognized institute.Excellent communication and collaboration skills to work with cross-site, cross-functional teams; strong ownership mindset and ability to drive issues to closure under aggressive schedules.