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Principal Engineer – Chip Design Front End
Principal Engineer – Chip Design Front EndToshiba Software (India) Pvt. Ltd. • India
Principal Engineer – Chip Design Front End

Principal Engineer – Chip Design Front End

Toshiba Software (India) Pvt. Ltd. • India
2 days ago
Job description

We are looking for a highly skilled Digital Front-End Lead to drive and contribute to chip-level architecture, RTL design, and verification, while managing and mentoring a high-performing team. The ideal candidate will possess deep technical expertise and leadership capabilities, with a strong background in SoC design, RTL coding, verification planning, and project management .

This role requires a proactive approach to continuous improvement and collaboration across disciplines. We are specifically seeking a Verification Leader with design exposure , capable of ensuring robust verification strategies while contributing to architectural and design decisions.

  • Target products are not FPGA-based.
  • Experience with MCU products featuring ARM cores is preferred.

Key Skills - Priority Level (1(Low) - 5(High))

Chip Level Verification – 5

  • Chip-Level Use Case Understanding
  • Verification Plan Formulation, Management, and Review
  • Extraction of verification items and formulation of verification program stimulus specifications
  • Building Dynamic & Static Verification Environments
  • Gate-Level Simulation with Back-Annotated Delays
  • Management -5

  • Leadership Experience, Project Planning, Collaboration with Backend and Analog Team
  • DFE Team Management
  • Documentation
  • Continuous Improvement Suggestions
  • Functional Safety Standards
  • RTL Design & Quality Verification - 4

  • RTL Quality Control
  • RTL Coding Skills (Verilog HDL / System Verilog)
  • RTL Quality Check Execution; EDA Tools for RTL Quality Checks
  • Architecture Design – 3

  • Chip-Level System Architecture Design
  • Block-level microarchitecture design
  • Constraint Creation and Synthesis (SDC / STA) - 3

  • Timing and synthesis constraints
  • Synthesis trial and STA report confirmation
  • Chip Level Assembly – 3

  • Chip-Level Assembly Using EDA Tools
  • Power System Design- 3

  • Multi-Power Domain Design
  • Power System Model Design
  • Testing, On-Board Evaluation, and Mass Production Support- 3

  • Evaluation Flow (Actual Machine Bring-up, ATE Pattern Generation)
  • Evaluation Specifications (test items such as SCAN, BIST, and cutout tests)
  • Power Estimate- 2

  • Power Analysis Using EDA Tools and Design Feedback
  • Power Estimation During Feasibility Stage
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    Front End Engineer • India

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