Surface Mount Technology Packaging Specialist

Roles : ISP Packaging Lead - OSAT Semiconductor

Experience : 10-15 Yrs

Education Qualification : Bachelor’s / Master’s in Mechanical, Electrical, or Electronics Engineering

Job Description

• Experience in semiconductor packaging with hands-on experience in SMT and TLA line management
• Oversee SMT and TLA line operations at OSAT sites, ensuring process stability, yield, and throughput targets
• Coordinate with materials, and test engineering teams to define packaging architecture and assembly flow
• Drive process optimization, equipment selection, and line readiness for NPI and high-volume production
• Manage DFM reviews, BOM validation, and package reliability qualification
• Interface with OSAT vendors for process audits, issue resolution, and continuous improvement initiatives.