Role : Sr Physical Design Lead / BE Integration This position is for senior level engineer Full Chip Physical Design / Integrations / SoC Floor planning / Bump Planning / Pin Assignments / Feed through / LFU Optimization / Physical Verification, Power design / implementation / signoff. He must have hands on Physical Design experience and must have handled RTL to GDS II at Top level
Key Responsibilities :
Expertise in hierarchical RTL2GDSII design implementation
Expertise in pin assignment, Power planning, IO / Bump Planning, Pad Ring Creation, Die File Creation, RDL Routing, working with Package Team for Optimize the Bumps
Full chip Hierarchical Floor Planning, Block planning, block level constraints, hierarchical clock tree implementation, block integration and chip finishing for Analog-Mixed Signals.
Experience in debugging LVS issues at chip-level with complex analog-mixed signal IPs
Low power design with power estimation / optimization including clock gating, power gating, power switch implementation and other low power techniques to reduce total power consumption.
excellent debugging skills
Expertise in FC (Fusion Compiler)
Expertise in Primetime, Calibre for DRC / LVS, Ansys Redhawk EMIR
Soft Skills –
Should be able to drive decision with cross functional Teams.
Good Communication Skills
Academic Credentials
Bachelors or Master's degree in Computer / Electronics / Electrical Engineering
Physical Design Engineer • Hosur, Tamil Nadu, India