Semiconductor Packaging and Test Lead

Roles : Manufacturing Lead- OSAT Packaging & Test

Experience : 5-15 Yrs

Location : Jagiroad, Assam.

Education Qualification : Bachelor’s or Master’s degree in Electronics, Mechanical, Manufacturing Engineering.

Job Description

• Experienced in manufacturing operations for wire bond, flip chip, and integrated system packaging and Testing of High Volume OSAT Semiconductor Manufacturing.
• To Planning & execution of the Targeted manufacturing Volumes.
• Ensure process stability, yield optimization, and cycle time reduction across packaging and test lines
• Manage daily OSAT interactions for issue resolution, performance tracking, and continuous improvement
• Support NPI and technology transfers with equipment, materials, and process alignment
• Conduct root cause analysis and implement corrective actions for process deviations
• Collaborate with design, test, substrate, and reliability teams for seamless product flow
• Maintain process documentation, control plans, and operator training programs
• Monitor KPIs and lead initiatives for cost, quality, and delivery improvements
• Oversee audits and ensure adherence to safety and regulatory requirements