THE ROLE :
As an Engineer II, you will be responsible for performing multilayer, controlled impedance printed circuit board (PCB) layout and analysis for advanced power and digital electronics. This role is integral to the New Product Develop teams, focusing on high-performance applications in Semiconductor, Power controls, Automotive, and Heat Treatment sectors. The engineer will collaborate with hardware design, mechanical design, and manufacturing engineers globally to ensure PCB designs meet critical design and signal integrity constraints while adhering to manufacturability standards.
RESPONSIBILITIES :
- Use Computer-aided design (CAD) tools to design the layout of Printed Circuit Boards.
- Support and Maintain the Computer-aided design (CAD) tools.
- Create full documentation package for PCB fabrication and for PCB assembly.
- Create and manage component libraries, including PCB footprint libraries.
- Design rule verification.
- Design for manufacturability (DFM) and test (DFT).
- Modification of existing schematics.
SKILLS / COMPETENCIES :
Must have :
Minimum two-year technical degree with three years of experience, or high school graduate and related experience (5 to 8 years).Siemens Xpedition Layout and Designer experience.Understanding of EMC principals and best practices to mitigate EMI.Working knowledge of electronics including signal and power integrity issues.Detailed understanding of high speed digital PCB routing constraints.Experience with schematic capture tools.Demonstrated computer skills (MS Office, ability to install and run various software programs).Demonstrated verbal and written communication skills.Demonstrated ability to work in a team-based environment.Fluent spoken and written English.Additional success factors :
PCB fabrication experience.Familiarity with IPC guidelines.Experience with ECO processes.Design Simulation experience.GerbTool Experience.Scripting Experience.