Senior Analog Layout Engineer (8–17 Years Experience)
Location : Hyderabad / Remote
Job Type : Full-Time
About the Role :
We are looking for a highly experienced Senior Analog Layout / IP Delivery Engineer with strong expertise in designing and integrating high-speed analog IPs at the chip level. This role requires deep knowledge of ICC2-based top-level integration, extensive IP verification experience, and the ability to run block-level simulations independently. The ideal candidate will take full ownership of IP development, verification, integration, and delivery—including foundry coordination, signoff, and tape-out.
Key Responsibilities :
Analog Layout & Integration
Lead chip-level planning and integration of high-speed analog IPs.
Execute complete analog layout design including floor planning, routing, device matching, shielding, EM / IR checks, and parasitic optimization.
Run post-layout simulations (corners, Monte Carlo, extracted netlist) and ensure correlation with schematic.
IP Verification & Signoff
Own the entire IP verification process : DRC, LVS, ERC, ANT, PEX, and reliability checks.
Ensure zero-violation GDS delivery for IP signoff.
Work closely with foundry teams on PDK clarifications, rule updates, model issues, PEX discussions, and tape-out requirements.
Cross-Functional Collaboration
Coordinate with PD, DV, circuit design, packaging, and integration teams for seamless IP delivery.
Prepare and deliver comprehensive IP documentation, abstracts, verification reports, and final GDS.
Process & Technology Expertise
Mandatory hands-on experience with TSMC 5nm.
Strong understanding of ICC2 flows for complete SoC / top-level integration.
Ability to run extracted and post-layout simulations for designed blocks.
Required Skills :
8+ years of proven experience in Analog / Mixed-Signal Layout.
Deep expertise in high-speed IPs : SERDES, PLL, ADC / DAC, Tx / Rx, clocking blocks.
Strong understanding of chip-level hierarchy, integration, and physical interfaces.
Proficiency in Cadence Virtuoso, PVS, Calibre, and extraction tools.
In-depth knowledge of :
DRC / LVS / ERC
PEX & RC Extraction
Signoff decks and reliability checks
Experience interfacing with foundry teams for rule clarifications and tape-out signoff.
Strong sense of ownership in IP development, customer communications, and documentation.
Good to Have :
Experience with other advanced process nodes (7nm / 3nm).
Exposure to SERDES / PCIe / MIPI / USB high-speed IPs.
Experience working with global clients.
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